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Dynamic Compression Summer School (DCSS)

Posted by:
February 3, 2022

The Dynamic Compression Summer School has been established to provide an overview of dynamic compression science appropriate for upper-level undergraduates and first-year graduate students. The four and a half days of activities will introduce students to the scientific fundamentals, contemporary research activities including informal discussions, and career opportunities within this exciting field.

The program includes an introduction to the many opportunities related to the study of material response under extreme conditions.

The summer school aims to strengthen ongoing interest and to enhance the long-term intellectual vitality of dynamic compression research. We encourage exceptional applicants with a desire to pursue a career or advanced degree, and who would contribute to the development, implementation and deployment of such technologies in practice.

What is Dynamic Compression Science?
Dynamic compression experiments subject materials to unique thermodynamic conditions – very large compressions, high temperatures, and large deformations – on short time scales resulting in a rich array of physical and chemical changes. Understanding the material response at these extreme conditions is of central importance to fundamental science and spans the disciplines of Physics, Chemistry, Materials Sciences, Geo/Planetary Sciences, and Solid Mechanics.

Research activities related to the dynamic compression of materials are extremely diverse and challenging. The Shock Wave Academic Partnership aims to strengthen ongoing efforts to enhance the long-term intellectual vitality of this field, which is uniquely suited for studying material response under extreme conditions.

Enrollment and Support Details
Enrollment is limited to 25 students.  Program support includes lodging, meals, and a stipend up to $500 for transportation costs. The program runs from July 31 – August 5, 2022.

Eligibility and Application Details
To learn about eligibility and application details, click here.